Responsibilities:-

DIE PREPARATION PROCESS • Perform process optimization to achieve the better die preparation yield and product quality as well as process robustness to meet the process Cpk. • Hands on for recipe management system in consolidating the die preparation recipes by different wafer type. • Involved actively in solving die preparation related issues (e.g. broken wafer, chipping, flying die, contamination, etc.) through 8D methodology. • Responsible to characterize the package / process systematically to exceeding quality and reliability requirements. • Responsible in understanding the key parameters definition and implement necessary control plan to achieve the 1st time right of process manufacturability. • Proactively conduct process optimization and improvement during feasibility to low volume (safe launch) phase to ensure successful High-Volume Manufacturing. • Responsible for process documentation, Setup Matrix / Parameter Cards / Work Instructions / Process Guides • As process owner and responsible to derive corrective action whenever encounter any quality or technical issue in respect to die preparation process. • Supports new material and tools, Customer Audits and Visits through knowledge and process sharing. WIRE BOND PROCESS • Perform process optimization to achieve the better wire bond yield and product quality as well as process robustness to meet the process Cpk. • Hands on for recipe management system in consolidating the wire bond recipes by different die type, package type and design ID. • Involved actively in solving wire bond related issues (e.g. broken wires, lifted pad, sagged wires, NSOP, NSOL, lifted stitch, IMC crack, bond pad crack) through 8D methodology. • Responsible to characterize the package / process systematically to exceeding quality and reliability requirements. • Responsible in understanding the key parameters definition and implement necessary control plan to achieve the 1st time right of process manufacturability. • Proactively conduct process optimization and improvement during feasibility to low volume (safe launch) phase to ensure successful High-Volume Manufacturing • Responsible for process documentation, Setup Matrix / Parameter Cards / Work Instructions / Process Guides • As process owner and responsible to derive corrective action whenever encounter any quality or technical issue in respect to the project. DIE ATTACH PROCESS • Perform process optimization to achieve the better die attach yield and product quality as well as process robustness to meet the process Cpk. • Hands on for recipe management system in consolidating the die attach recipes by different die type, package type and design ID. • Involved actively in solving die attach related issues (e.g. crack die, epoxy on die, mis-aligned die, insufficient epoxy, etc.) through 8D methodology. • Responsible to characterize the package / process systematically to exceeding quality and reliability requirements. • Responsible in understanding the key parameters definition and implement necessary control plan to achieve the 1st time right of process manufacturability. • Proactively conduct process optimization and improvement during feasibility to low volume (safe launch) phase to ensure successful High-Volume Manufacturing. • Responsible for process documentation, Setup Matrix / Parameter Cards / Work Instructions / Process Guides • As process owner and responsible to derive corrective action whenever encounter any quality or technical issue in respect to the project. • Supports Customer Audits and Visits through knowledge and process sharing. • Support new material and tools (ejector/stage/rubber tip/collet) qualification PACKAGE DEVELOPMENT PROCESS • Analyzing, maintaining, improving and planning strategies in designing new processes and products. • Continual improvement through process / equipment optimization for all products. • Negotiate with customers on design / product specification • Develop and qualify new processes • Coordinate with related department to keep assembly yield, quality, cycle time of product. • Coordinate on new release assembly process. • Identify and optimize process parameters. • Collaborate with related department on new materials, processes and equipment approval.

Requirements:-

• Masters/Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent • Familiarity with QFN, TSSOP, SOIC and SOT packages is an added advantage • Familiarity with ASM, K&S and ESEC wirebond machine is an added advantage • Good in critical thinking and systematic problem-solving skills e.g., DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bone, IS-IS NOT etc. • Familiarity with statistical analytical software (JMP/Minitab) is an added advantage. • Mastery of Microsoft Office Application • Good written and verbal presentation skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings • Knowledge on Die Preparation process; wafer back grind and wafer saw machine. • Knowledge on Die Preparation process; wafer back grind and wafer saw machine. • Fluency with Statistical analysis methodology/tools such as Root Cause Analysis, SPC, FMEA, Control Plans, and MSA (or Gauge R&R) • Fluent in English and Mandarin is an added advantage. • Minimum of 3-5 years experienced in process engineering capacity

Responsibilities:-

• Responsible for the maintenance of all Test operations and other supporting equipment which related to Test process operations. • Responsible to maintain all Test process operations up time to meet the targeted UPH and production schedule • Test equipment includes: Testers, handlers, Vision, Tape and Reel etc • Responsible to supervise Engineer/AE/TS/Tech in maintaining and improving machine’s reliability and up time. • As a key person to procure and buy-off new Test equipment and documentation. • Continuously working together with Product Engineering group to improve product yield and ensures sufficient capacity to support production. This includes sourcing for new capabilities. • Manage the Preventive Maintenance crew • Performing any tasks assigned by the Management where appropriate to support business needs. • Set up master preventive maintenance schedule and spec to ensure all TEST process operations/equipment are properly maintained within due dates by technician or vendors • Maintain inventory of critical spare parts and consumables to reduce any down time. • Control procurement of spare parts / vendor or supplier service to meet the monthly budget. • Update and improve procedures for preventive maintenance of TEST process operations/equipments • Provide technical coach/training to subordinates to improve job efficiency • Monitor/take action of subordinates tardiness/discipline.

Requirements:-

• Masters/Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics • Minimum of 3-5 years experienced in process engineering capacity • Fluent in English and Mandarin is an added advantage

Responsibilities:-

• Develop and qualify new processes or add additional modules/features into existing processes. • Support new product introduction from tapeout till prototyping success by aligning with customer’s expectation. • Use process integration and semiconductor device knowledge to troubleshoot and resolve inline measurement and electrical test issues. • Identify and solve line and wafer yield related problems. Lead and drive issues to closure. • Run DOE to optimize process margins. • Monitor critical inline measurement and electrical test parameters SPC trend and CPK to ensure production wafers meet the require quality.

Requirements:-

• Masters/Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Industrial/Chemical • Minimum of 3-5 years experienced in process engineering capacity • Fluent in English and Mandarin is an added advantage. • Willing to work in Kulim Hi-Tech area.

Responsibilities:-

• Overall planning of resources to support planned capacity that includes indirect materials attires and tools. • Responsible and accountable for Mses' discipline, target output and quality. • Comprehend, plan and provide relevant manufacturing practices and system to ensure line execution is in control all the time. • Continuously working out programs towards improving Mses productivity and efficiency by effectively using systematic problem-solving methods/tools as well as effective data analysis. • To motivate and groom selected Mses to take up more responsiblities to assits Production Supervisor in day -to-day management of business and provides them with career path in AIC. • Continuously working together with other department to achieve the operation objectives. • Acting for Superior during his/her absent for the area under job scope.

Requirements:-

• Diploma in any discipline • Minimum of 5 years experienced in Supervisory capacity, in Semiconductor environment • Experience in semiconductor

Responsibilities:-

• Highlight all quality issues and pursue corrective actions with relevant parties to contain any problem. • Allocate sufficient resources for effective QA support. • Review and disseminate any QA related assembly / test instructions or changes to QA leaders and inspectors. • Follow-up on all corrective actions and close the issue. • Generate weekly quality reports of lot rejection ratios and defect ppm for monitoring quality level. IN COMING QA • Implement Incoming QA on direct material and critical indirect material based on approved quality plans upon receipt at store. • Confirm and monitor any rejection at incoming inspection. • Provide guidance to inspectors on methods and criteria for incoming inspection. • Feedback any quality issues to purchaser / vendors and follow-up on corrective actions. • Feedback any quality issues to customers on consigned parts eg. Wafers • Updates IQA specifications and procedures. • Liase with appropriate vendor on the program to improve vendor rating. OTHERS • Responsible for any specific QA functions or administration duties as may be assigned from time to time by the manager or immediate superior.

Requirements:-

• Degree in Electrical/Electronic Engineering.

Responsibilities:-

• Responsible to enhance all FOL equipment performance base on up time to meet the targeted UPH and production schedule. • Responsible to supervise and delegate project assignment to TS/Tech to achieve the desired performance improvement. • As a key person to procure and buy-off new equipment. • Continuously working together with process engineering group to improve product yield and ensures sufficient capacity to support production. This includes sourcing for new capabilities. • Management of Preventive Maintenance crew. • Performing any tasks assigned by the management where appropriate to support business needs. • Setup master preventive maintenance schedule and ensure all FOL equipment. • Update and improve procedures for preventive maintenance of FOL equipment. • Provide technical coach/ training to subordinates to improve job efficiency. • Monitor/ take action on subordinates tardiness/ discipline.

Requirements:-

• Diploma in Mechanical/Electrical Engineering or Degree in Electrical/Electronic or Mechatronics. • Good in critical thinking and systematic problem-solving skills e.g., DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bone, IS-IS NOT etc. • Familiarity with statistical analytical software (JMP/Minitab) is an added advantage. • Mastery of Microsoft Office Application • Good written and verbal presentation skills in English. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings. • Fresh graduates are encouraged to apply for the engineer post • Prefer Mandarin speaking candidates

Responsibilities:-

• Responsible to enhance all FOL equipment performance base on up time to meet the targeted UPH and production schedule. • Responsible to supervise and delegate project assignment to TS/Tech to achieve the desired performance improvement. • As a key person to procure and buy-off new equipment. • Continuously working together with process engineering group to improve product yield and ensures sufficient capacity to support production. This includes sourcing for new capabilities. • Management of Preventive Maintenance crew. • Performing any tasks assigned by the management where appropriate to support business needs. • Setup master preventive maintenance schedule and ensure all FOL equipment. • Update and improve procedures for preventive maintenance of FOL equipment. • Provide technical coach/ training to subordinates to improve job efficiency. • Monitor/ take action on subordinates tardiness/ discipline.

Requirements:-

• Diploma in Mechanical/Electrical Engineering or Degree in Electrical/Electronic or Mechatronics. • Good in critical thinking and systematic problem-solving skills e.g., DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bone, IS-IS NOT etc. • Familiarity with statistical analytical software (JMP/Minitab) is an added advantage. • Mastery of Microsoft Office Application • Good written and verbal presentation skills in English. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings. • Fresh graduates are encouraged to apply for the engineer post • Prefer Mandarin speaking candidates

Responsibilities:-

• Responsible for all daily operation activities and supervising all technicians. • Setup & maintain all printers. • Responsible for HELPDESK activities. • Preparing all require reports for daily production needs. • Responsible for MIS room neatness & condition.

Requirements:-

• Certificate or Diploma in computer or IT from recognize college. • Minimum 2 years working experience in manufacturing environment.

Responsibilities:-

• Plan for production schedule to meet customer demand. • Prepare and control loading & WIP. • Attend to meeting impact to deliveries matters. • Weekly reports making. • Monitoring delivery schedule. • Shipment arrangement.

Requirements:-

• Diploma or Bachelor's degree in Business, Management or equivalent. • Proficiency in Microsoft Office. • Strong analytical abilities, sense of urgency and multitasking. • Mandarin Speaker.

Responsibilities:-

• Process Control of Mold-Plating-Marking-Trim/Form and Sealant Process. • Keen in problem solving and trouble shooting.

Requirements:-

• Diploma or Degree in Science or Engineering. • Computer literate for data compilation and report writing. • Basic lab analysis, titration method.

Responsibilities:-

• Provide technical support and application guidance for external customers. • Field service (onsite support) for customer, conduct/support field trial and testing. • Gather technical info from customer/competitor and feed back to R&D. • Assure customer expectations and requirements will be met & carried out. • Build and maintain customer relationships at various management levels. • Business discussion for any new potential customer. Supervise Pre-assembly Engineering activities. · • Procurement of direct & critical indirect materials as well for stock planning. · • Working with respective department/s for any new material &/or alternate source qualification which is subject to customer’s approval. · • Negotiation with suppliers to seek the most competitive cost. · Other important related tasks that may be assigned by the manager from time to time.

Requirements:-

• Degree Holder of any materials fields or technical support. • Minimum 3 years of technical support experience in manufacturing environment. • Be willing to go abroad frequently (Thailand, Singapore, India, Malaysia) and stay at customer factory long-term• . • Willing to study for three months in China at the beginning. • Mandarin Speaker

Responsibilities:-

• Responsible to support In-House Software Development; • Responsible to analyzes, designs, develops and documents computer information systems. • Serves as project leader to guide systems through programming, testing and implementation, investigates and recommends software for purchase and provides support and leadership through implementation • Creating system guidelines and manuals for the organization. • Running training sessions and workshops on system processes. • Conducting regular reviews of systems and generating reports on efficiencies and improvement areas. • To be part of the team in supporting SAP and MES Application System; • To liaise closely with other department regarding In-House System; • Provides ongoing enhancements;

Requirements:-

• Degree or Diploma in Computer Science or Certificate in IT • Senior System Analyst (more than 4 years) / Programmer: 2 years (Preferred) • SAP/ERP Knowledge (an Advantage) • Knowledge and experience in any software development / programming • Knowledge on database management SQL 2008 R2; • Familiar in MES System including Labelling Software (Loftware / Bartender); • Candidate must be a responsible person; • Possess a positive attitude and able to work independently; • Able to communicate in English and Bahasa Malaysia.

Responsibilities:-

• Be responsible for collaborating with NPI team and/ or leading improvement projects to develop effective manufacturing processes or technique which meet product requirement. • Establish guidance and/or cultivate Quality Culture and Lean Manufacturing concept to supervisors, production leaders, module leads on processes introduction, improvement and sustaining. .• A Key coordinator in production to collaborate with others department to conduct control run, sample run and DOE. • Follow up respective process owner on yield improvement plan, progress and report.

Requirements:-

• Bachelor Degree of Science in any engineering discipline. • Have a good self spirit and good communication skill. • A multitasker, committed and pro-active driven for result. • Proficiency in Microsoft App. • Language proficiency in Mandarin will be added advantage.

Responsibilities:-

• Able to identify, develop and resolve process related issues for continuous improvement in yield, quality & reliability and productivity. • Able to provide engineering solutions/support to assembly operations; • Involved in process development and optimization for new device/package. • Lead a team of engineers and technicians to achieve operation goals in yield, quality, output, on time delivery, productivity, cycle time and cost. • To setup plating process. • To develop and to industrialize plating process with vertical and horizontal equipment for new packages, introduce materials to meet the quality, yield, and mission of new application. • To support assembly of engineering sample for new packages or new technologies. • To characterize assemble plating process and materials. • To generate and update process specifications, SOP, FMEA and process control plan. • To provide technical support when there are critical quality concerns related to assembly EOL material / process

Requirements:-

• Degree in Electrical/Electronic/Mechanical Engineering or equivalent technology related qualification; • Minimum 3 - 5 years' experience in IC assembly manufacturing operations, preferably in Plating • A team player with strong analytical abilities, problem-solving skills. • Leadership ability in driving a team of engineers and technicians to meet process capability, yields and throughput targets; • Equipped with statistical data analysis, analytical and problem-solving skills especially at plating process. • Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is not…etc. • Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area. • Practice high performance behaviour and together work as Team in executing projects & strive for excellent. • Good communication skills in English and Mandarin.